Confluence Circuits

Infrastructure

Infrastructure

We ensure that every product we deliver meets the highest industry standards

MANUFACTURING FACILITY

We are located in Silicon Valley of Bangalore, India with fully equipped automatic SMT & PTH Line with 6100 Sqft of work space.

MANUFACTURING EQUIPMENTS

1. ETA FULLY AUTOMATIC SCREEN PRINTER

ModelE-Star
Frame Size(mm)370*370 ~ 737*737
Thickness25~40mm
PCB Size(mm)50*50 ~ 400*340
PCB Thickness0.4~6mm
PCB Warpage<1%
Transport Height900±20mm
Transport DirectionLeft-Right; Right-Left; Left-Left; Right-Right
Transport SpeedMax 1500mm/s
Support SystemMagnetic Pin/Up-down table adjusted/support block
Clamping SystemSide clamping, vacuum nozzle, Automation retractable Z pressure
Printer HeadTwo independent motorised printhead
Squeegee Speed6~200mm/sec
Squeegee Pressure0~15kg
Squeegee Angle60°/55°/45°
Squeegee TypeStainless steel(standard), Plastic
Release Speed0.1~20mm/sec
Cleaning SystemDry, Wet, Vacuum
Table Adjustment RangesX:±10mm;Y:±10mm;θ:±2°
Table Adjustment controlMotor
Mark TypesCircle,Triangle,Square,Diamond,Cross
Mark Size0.5~3.0mm
CCD FOV10*8mm
Vision MethodologyCCD, Top and Bottom
Inspection2D Inspection (Standard)
Repeat Accuracy±0.01mm(CPK ≥ 2.0)

2. JUKI 3D BOARD VISUAL INSPECTION MACHINE (RV – 2 – 3DH)

Board size50mm×50mm-410mm×300mm
50mm×50mm-630mm×300mm (action to long board)*1
Test resolution12μm (standard resolution)/5μm (high resolution)*1
Image angle48.0×36.0mm、20.0×15.0mm*1
Inspection itemsShorting, shear, polarity, side-reverse, unsoldered solder, bridge, solder quantity, insertion part omission, character recognition*1
FOV (Optimum condition) 2D0.2sec/1 screen
FOV (Optimum condition) 3D61.8cm²/sec

3. JUKI FAST SMART MODULAR MOUNTER (RS – 1R) - 1

Fast Smart Modular Mounter

Model
RS-1R
Conveyor specification
Standard 150mm conveyor extensions, upstream and downstream 250mm conveyor extensions, upstream and downstream
Board size – Minimum
50×50mm
Board size – Maximum – 1 buffer
950x370mm (double clamping) 1,100x370mm (double clamping) 1,200x370mm (double clamping)
Board size – Maximum – 3 buffers
360x370mm 500x370mm 600x370mm
Component Height
25mm
Component Size
0201*1 ~□74mm / 150x50mm
Placement speed
Optimum – 47,000CPH IPC9850 – 31,000CPH
Placement accuracy
±35μm(Cpk≧1)
Vision recognition
±30μm
Feeder inputs
max.112*2

4. JUKI FAST SMART MODULAR MOUNTER (RS – 1R) - 2

Fast Smart Modular Mounter
Model
RS-1R
Conveyor specification
Standard 150mm conveyor extensions, upstream and downstream 250mm conveyor extensions, upstream and downstream
Board size – Minimum
50x50mm
Board size – Maximum – 1 buffer
950x370mm (double clamping) 1,100x370mm (double clamping) 1,200x370mm (double clamping)
Board size – Maximum – 3 buffers
360x370mm 500x370mm 600x370mm
Component Height
25mm
Component Size
0201*1 ~□74mm / 150x50mm
Placement speed
Optimum – 47,000CPH IPC9850 – 31,000CPH
Placement accuracy
±35μm(Cpk≧1)
Vision recognition
±30μm
Feeder inputs
max.112*2

5. ETA T-T SERIES LEAD FREE REFLOW OVEN

ETA Reflow Oven Specifications
S – Standard, O – Option, M – Manual, A – Auto, N/A – Not Available
Specifications
T800T T100T
Machine Dimension (L*W*H)mm
5000x1200x1450 5300x1200x1450
Package Dimension (L*W*H)mm
5250x1400x1650 5550x1400x1650
Weight
Approx.1790KG Approx.2150KG
Board Dropped Alarm
S S
Standard Colour
Computer Grey
Electrical SMEMA Interface
N/A
Number Of Heating Zones
Up8/Bottom8 Up10/Bottom10
Length Of Heating Zones
3121mm 3891mm
Computer
Lenovo
Max.Width Of PCB
400mm
Rail Width
Adjustment

6. FULLY AUTOMATIC BGA PLACEMENT & REWORK STATION

For high volume BGA Rework on even the largest computer and networking boards!
This BGA Rework System has High-Definition, Auto-X-Y and Theta Split-Vision Alignment for Automatic Removal, Placement, and Soldering of BGAs, CGA’s, CSPs, QFPs, LGA’s and Other SMDs. The rapid-IR underheated is a must for large PCB’s with many layers or heavy ground planes.
Auto soldering and mounting function.
Standard fits Boards to 24″, Optional upgrade to 36″
Places components 4mm and up. Optional 1mm upgrade available.
1200 watt component heater (Top Side)
800 watt component heater (Bottom Side)
6-zone 3600 Watt rapid-IR under heater
Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
Color optical system with functions of split vision, zoom in/out and micro-adjust.
Auto focus and software operation function, 2 million pixel high-definition camera.
15’’ high-definition LCD monitor.
Five Thermal Couple Inputs.
Fully self contained with PLC control. No need for external air.

7. FULLY AUTOMATIC BGA PLACEMENT & REWORK STATION

Item
SunzonTech S-7000
Panel Detector
Pixel Pitch 85 um
Inspection area 300*350mm
Detector Tilt Angle /
Microfocus
Optical Tube Style Sealed Tube
X-ray source
Optical Tube Voltage 90KV,100KV Optional
Optical Tube Current 250UA
Focal spot 5 um
Optical Tube Power 8W
System Magnification 200X
Resolution 2 um
Sample Table
X-Axis 350 mm
Y-Axis 400 mm
Tube-Axis Moving Range 380 mm
Detector-Axis Movmg Range 380 mm
Platform Deadweight 10 KG
Software Function
Size Detection Point to Point &Line to Line angle Measure
Bubble Detecion Bubble Caculation
Power
Power Supply AC110-230AV, 50/60Hz
Computer
Brand Dell
Operation System Windows 10
Display 24” LCD
CPU Intel i5 6500
Radiation Standard
<luSv/hr Radiation Leakage
Radiation Exemption Certificate Provided
Machine Shell
Dimension 1010mm*930mm*1660mm
Weight 820KG
Other functions
Simple mouse click operation to operate detection program.
Sample Table can be positioned in X, Y direction; X-ray optical tube in Z direction.
Users can set the pause time for program switching
Anti collision system can achieve the maximum tilt and observation